The soft polishing pad is made to the highest standards using OpenCell technology. It features a cooling hole in the center. This polishing pad is used for finishing polishing tasks and is designed to be used with low-abrasion polishes. It effectively removes holograms. Suitable for use with both dual-action (DA-Dual Action) and rotary machines.
* Do not overheat the sponge, and avoid using high speeds in one spot;
* Allow the sponge to cool down;
* Blow air through the sponge to clean it.
